Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 89
... Foamed Polyimide Structure O = Air / Void Figure 2. Foam Formation Process size and shape of the foamed structure that is eventually desired . Since we are concerned with generating non - interconnected porous foams with domains in the ...
... Foamed Polyimide Structure O = Air / Void Figure 2. Foam Formation Process size and shape of the foamed structure that is eventually desired . Since we are concerned with generating non - interconnected porous foams with domains in the ...
Page 94
... foamed in an oxygen free atmosphere . This is desirable for use of nanofoams in microelectronic fabrication processes . In order to be incorporated into imide copolymers , it was necessary to synthesize labile block oligomers with amino ...
... foamed in an oxygen free atmosphere . This is desirable for use of nanofoams in microelectronic fabrication processes . In order to be incorporated into imide copolymers , it was necessary to synthesize labile block oligomers with amino ...
Page 95
... foamed polymers is the lowering of residual thin film stress . In the case of PMDA / 3FDA the residual stress of the foamed polymer is 45 % less than that of the non - foamed polyimide . TEM micrographs of nanofoams show that discrete ...
... foamed polymers is the lowering of residual thin film stress . In the case of PMDA / 3FDA the residual stress of the foamed polymer is 45 % less than that of the non - foamed polyimide . TEM micrographs of nanofoams show that discrete ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch