Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 9
... fracture toughness measured on thin films is 0.62 MPa m2 . Thin coatings absorb less than 0.25 wt . % water when exposed to 80 % relative humidity at room temperature . a trademark of The Dow Chemical Company INTRODUCTION Spin - on ...
... fracture toughness measured on thin films is 0.62 MPa m2 . Thin coatings absorb less than 0.25 wt . % water when exposed to 80 % relative humidity at room temperature . a trademark of The Dow Chemical Company INTRODUCTION Spin - on ...
Page 11
... Fracture toughness was measured on thin films using the modified edge liftoff test ( ELT ) . The general procedure for this test is to apply a well characterized epoxy backing layer to the test film , cleave the sample to create a ...
... Fracture toughness was measured on thin films using the modified edge liftoff test ( ELT ) . The general procedure for this test is to apply a well characterized epoxy backing layer to the test film , cleave the sample to create a ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch