Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 37
Page 6
Elongation to break as a function of alkoxysilane norbornene content . The silane improves the adhesion of the polymer and increases the elongation to break , but because the silane is a polar molecule it was anticipated that an ...
Elongation to break as a function of alkoxysilane norbornene content . The silane improves the adhesion of the polymer and increases the elongation to break , but because the silane is a polar molecule it was anticipated that an ...
Page 33
2.25 0.025 2.00 0.000 0 0 10 20 30 40 50 60 10 50 60 20 30 40 Time ( min ) Time ( min ) Figure 3 : Dielectric constant at 10 % Hz as a function of a Figure 4 : Loss tangent at 10 % Hz as a function of a thermal soak at 400 ° C in 4 Torr ...
2.25 0.025 2.00 0.000 0 0 10 20 30 40 50 60 10 50 60 20 30 40 Time ( min ) Time ( min ) Figure 3 : Dielectric constant at 10 % Hz as a function of a Figure 4 : Loss tangent at 10 % Hz as a function of a thermal soak at 400 ° C in 4 Torr ...
Page 126
4 Stress as a function of temperature for the low dose e - beam cured film . 80 80 E - Beam / High Dose OHeating Phase --Cooling Phase UNIVERSITY OF MICHIGAN LIBRARIES 60 Heating Phase -Cooling Phase 60 40 40 Stress ( MPa ) Stress ( MPa ) ...
4 Stress as a function of temperature for the low dose e - beam cured film . 80 80 E - Beam / High Dose OHeating Phase --Cooling Phase UNIVERSITY OF MICHIGAN LIBRARIES 60 Heating Phase -Cooling Phase 60 40 40 Stress ( MPa ) Stress ( MPa ) ...
What people are saying - Write a review
We haven't found any reviews in the usual places.
Contents
Polynorbornene for Lowk Interconnection | 3 |
High Thermal Stability for ULSI Interlayer Dielectric | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
33 other sections not shown
Other editions - View all
Common terms and phrases
addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode modulus moisture observed obtained occurs oxide oxygen PA-N peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films solution spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer