Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 3
... glass transition temperature , good mechanical performance and good adhesive properties , particularly to copper . In addition , the desired dielectric material should be capable of being processed in environmentally friendly solvents ...
... glass transition temperature , good mechanical performance and good adhesive properties , particularly to copper . In addition , the desired dielectric material should be capable of being processed in environmentally friendly solvents ...
Page 100
... glass in excess of 500 ° C , as measured by a thermocouple placed in the bore of the tube . The bore of the glass tube is slightly larger than the diameter of the aerogel spheres . The position of an aerogel sphere placed inside the ...
... glass in excess of 500 ° C , as measured by a thermocouple placed in the bore of the tube . The bore of the glass tube is slightly larger than the diameter of the aerogel spheres . The position of an aerogel sphere placed inside the ...
Page 261
THERMAL STABILITY STUDY OF THE INTERCONNECT SYSTEM WITH FLUORINATED SILICATE GLASS AS IMD LAYERS Weidan Li , and Wilbur Catabay LSI Logic Corp. , R & D Division , Santa Clara , CA 95054 Abstract While fluorinated silicate glass ( FSG ) ...
THERMAL STABILITY STUDY OF THE INTERCONNECT SYSTEM WITH FLUORINATED SILICATE GLASS AS IMD LAYERS Weidan Li , and Wilbur Catabay LSI Logic Corp. , R & D Division , Santa Clara , CA 95054 Abstract While fluorinated silicate glass ( FSG ) ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch