Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 3
... glass transition temperature polynorbornenes are being developed which provide many of these desired features . This polymer family is produced via a new transition metal catalyzed polymerization . Attributes which make polynorbornene ...
... glass transition temperature polynorbornenes are being developed which provide many of these desired features . This polymer family is produced via a new transition metal catalyzed polymerization . Attributes which make polynorbornene ...
Page 9
... glass transition temperature for the fully cured film is greater than 490 ° C . The coefficient of thermal expansivity is 66 ppm / ° C below the glass transition temperature . The stress in fully cured films on Si wafers is ca. 60 MPa ...
... glass transition temperature for the fully cured film is greater than 490 ° C . The coefficient of thermal expansivity is 66 ppm / ° C below the glass transition temperature . The stress in fully cured films on Si wafers is ca. 60 MPa ...
Page 125
... glass transition temperature . However , the e - beam cure at high dose enhanced the glass transition temperature beyond 400 ° C . In the tests done on e - beam cured films , irrespective of the e - beam dose , there is hysteresis in ...
... glass transition temperature . However , the e - beam cure at high dose enhanced the glass transition temperature beyond 400 ° C . In the tests done on e - beam cured films , irrespective of the e - beam dose , there is hysteresis in ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch