Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 5
... group can also affect key performance properties such as dielectric constant . The dielectric constant of a material at moderate to high frequencies is a function of the concentration of polar groups . As polar groups are added to the ...
... group can also affect key performance properties such as dielectric constant . The dielectric constant of a material at moderate to high frequencies is a function of the concentration of polar groups . As polar groups are added to the ...
Page 35
... groups in various configura- tions , including olefinic , and aromatic groups [ 7,10-12 ] . D'Agostino et al . show measurable quantities of sp2 bound carbon groups in similar films [ 13 ] . The increase in these bands implies creation ...
... groups in various configura- tions , including olefinic , and aromatic groups [ 7,10-12 ] . D'Agostino et al . show measurable quantities of sp2 bound carbon groups in similar films [ 13 ] . The increase in these bands implies creation ...
Page 273
... groups . INTRODUCTION There is considerable interest in insulating films with static dielectric constants , Es , lower than SiO2 for use as isolating layers between thin film metal interconnects in integrated circuits . One alloy system ...
... groups . INTRODUCTION There is considerable interest in insulating films with static dielectric constants , Es , lower than SiO2 for use as isolating layers between thin film metal interconnects in integrated circuits . One alloy system ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch