Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 52
... Heat treatment of Chemat - B coatings in different atmospheres at different temperatures with different heating profiles were performed . Characterization at structural changes performed by FT - IR , SEM , TEM and Auger spectroscopy ...
... Heat treatment of Chemat - B coatings in different atmospheres at different temperatures with different heating profiles were performed . Characterization at structural changes performed by FT - IR , SEM , TEM and Auger spectroscopy ...
Page 53
heat treated in N2 at 450 ° C , the inorganic structure of the coating material become more rigid , and most of the micropores were sealed to become closed pores . Therefore , with further firing in air , the composition and ...
heat treated in N2 at 450 ° C , the inorganic structure of the coating material become more rigid , and most of the micropores were sealed to become closed pores . Therefore , with further firing in air , the composition and ...
Page 100
... heating them in a nitrogen purged furnace to 500 ° C , for 120 minutes . The spheres were cooled to 25 ° C in a ... heat loss of the sample . The apparatus in Fig . 1 was devised for this purpose utilizing the cavity perturbation ...
... heating them in a nitrogen purged furnace to 500 ° C , for 120 minutes . The spheres were cooled to 25 ° C in a ... heat loss of the sample . The apparatus in Fig . 1 was devised for this purpose utilizing the cavity perturbation ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch