Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 37
... hydrogen silsesquioxane since it affects structure and properties of the spin on dielectric material . Reported herein is the effect of soak temperature , time , and oxygen concentration process parameters on structure and properties of ...
... hydrogen silsesquioxane since it affects structure and properties of the spin on dielectric material . Reported herein is the effect of soak temperature , time , and oxygen concentration process parameters on structure and properties of ...
Page 40
... hydrogen silsesquioxane to generate polar species such as silanol and water is the primary contribution to dielectric constant deterioration . As a first approximation , influence of density on dielectric constant is modeled for hydrogen ...
... hydrogen silsesquioxane to generate polar species such as silanol and water is the primary contribution to dielectric constant deterioration . As a first approximation , influence of density on dielectric constant is modeled for hydrogen ...
Page 43
... hydrogen silsesquioxane . Dielectric constant data deviating from model is attributed to cure processing under oxidative conditions producing polar silanol and water species . Norm . SIH Bond Density , % 25 25 500 75 100 8 0 350 0.5 400 ...
... hydrogen silsesquioxane . Dielectric constant data deviating from model is attributed to cure processing under oxidative conditions producing polar silanol and water species . Norm . SIH Bond Density , % 25 25 500 75 100 8 0 350 0.5 400 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch