Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 14
... important because their product generally has a strong influence on the stress generated in the dielectric layer ... important characteristic of polymeric materials . At Tg , the modulus and CTE change in an abrupt fashion as long range ...
... important because their product generally has a strong influence on the stress generated in the dielectric layer ... important characteristic of polymeric materials . At Tg , the modulus and CTE change in an abrupt fashion as long range ...
Page 129
... important consideration when comparing polyimides against . other low - K contenders is the anisotropy in dielectric constant , where the in - plane dielectric con- stant , Kin - plane , can exceed the typically advertised out - of ...
... important consideration when comparing polyimides against . other low - K contenders is the anisotropy in dielectric constant , where the in - plane dielectric con- stant , Kin - plane , can exceed the typically advertised out - of ...
Page 186
Another important feature of non equilibrium plasma processes is the chance of changing the relative importance in the modification process of neutral active species VS. charged particles . In fact , by utilising the proper reactor ...
Another important feature of non equilibrium plasma processes is the chance of changing the relative importance in the modification process of neutral active species VS. charged particles . In fact , by utilising the proper reactor ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch