Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 6
... improved adhesion , the alkoxysilane also improves the elongation to break of the cyclic polyolefin . The addition of the alkoxysilane increased the elongation to break of the polymer to approximately 16 % with 20 mol % of the ...
... improved adhesion , the alkoxysilane also improves the elongation to break of the cyclic polyolefin . The addition of the alkoxysilane increased the elongation to break of the polymer to approximately 16 % with 20 mol % of the ...
Page 115
... improvement in gap filling behavior . Figure 1 illustrates the gap fill behavior of FPI as spin - coated and cured from ... improve gap fill has been to incorporate plasticizers which depress the polyimide's glass transition temperature ...
... improvement in gap filling behavior . Figure 1 illustrates the gap fill behavior of FPI as spin - coated and cured from ... improve gap fill has been to incorporate plasticizers which depress the polyimide's glass transition temperature ...
Page 205
... improve the performance of the dielectric , specifically by lowering the permittivity , increasing the thermal stability and improving the adhesion to silicon dioxide . A highly crosslinkable comonomer 2,4,6,8 - tetramethyl - 2,4,6,8 ...
... improve the performance of the dielectric , specifically by lowering the permittivity , increasing the thermal stability and improving the adhesion to silicon dioxide . A highly crosslinkable comonomer 2,4,6,8 - tetramethyl - 2,4,6,8 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch