Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 19
Page 6
... improved adhesion , the alkoxysilane also improves the elongation to break of the cyclic polyolefin . The addition of the alkoxysilane increased the elongation to break of the polymer to approximately 16 % with 20 mol % of the ...
... improved adhesion , the alkoxysilane also improves the elongation to break of the cyclic polyolefin . The addition of the alkoxysilane increased the elongation to break of the polymer to approximately 16 % with 20 mol % of the ...
Page 7
... improved the elongation . At the highest levels of alkoxysilane examined , elongation to break values exceeded 40 % . The dielectric constant of the copolymer as a function of alkoxysilane norbornene content improved as expected . The ...
... improved the elongation . At the highest levels of alkoxysilane examined , elongation to break values exceeded 40 % . The dielectric constant of the copolymer as a function of alkoxysilane norbornene content improved as expected . The ...
Page 197
... improved adhesion , thermal stability , and permittivity . We discovered that a copolymer of tetravinyl - tetramethyl - cyclotetrasiloxane and Parylene - N has a permittivity of close to 2.1 and both the adhesion to SiO2 and thermal ...
... improved adhesion , thermal stability , and permittivity . We discovered that a copolymer of tetravinyl - tetramethyl - cyclotetrasiloxane and Parylene - N has a permittivity of close to 2.1 and both the adhesion to SiO2 and thermal ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch