Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 6
In addition to improved adhesion , the alkoxysilane also improves the elongation to break of the cyclic polyolefin . The addition of the alkoxysilane increased the elongation to break of the polymer to approximately 16 % with 20 mol ...
In addition to improved adhesion , the alkoxysilane also improves the elongation to break of the cyclic polyolefin . The addition of the alkoxysilane increased the elongation to break of the polymer to approximately 16 % with 20 mol ...
Page 7
The alkoxysilane provides the necessary adhesion and some improvement in elongation , while the more flexible alkyl chain lowers the modulus and further ... The addition of the alkoxysilane norbornene further improved the elongation .
The alkoxysilane provides the necessary adhesion and some improvement in elongation , while the more flexible alkyl chain lowers the modulus and further ... The addition of the alkoxysilane norbornene further improved the elongation .
Page 197
Parylene Copolymers Kelly J. Taylor , Mona Eissa , Justin F. Gaynor , Shin - Puu Jeng , Hoan Nguyen SPDC , Texas Instruments , Inc. , P.O. Box 3701 , Dallas , TX 75265 ABSTRACT Improvements in the properties of Parylene may enable their ...
Parylene Copolymers Kelly J. Taylor , Mona Eissa , Justin F. Gaynor , Shin - Puu Jeng , Hoan Nguyen SPDC , Texas Instruments , Inc. , P.O. Box 3701 , Dallas , TX 75265 ABSTRACT Improvements in the properties of Parylene may enable their ...
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Contents
Polynorbornene for Lowk Interconnection | 3 |
High Thermal Stability for ULSI Interlayer Dielectric | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode modulus moisture observed obtained occurs oxide oxygen PA-N peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films solution spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer