Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 38
Page 129
ELECTRICAL EXTRACTION OF THE IN - PLANE DIELECTRIC CONSTANT OF FLUORINATED POLYIMIDE ALVIN L.S. LOKE * , JEFFREY T. WETZEL , JOHN J. STANKUS , S. SIMON WONG * * Center for Integrated Systems , Stanford University , CIS 017 MC 4070 ...
ELECTRICAL EXTRACTION OF THE IN - PLANE DIELECTRIC CONSTANT OF FLUORINATED POLYIMIDE ALVIN L.S. LOKE * , JEFFREY T. WETZEL , JOHN J. STANKUS , S. SIMON WONG * * Center for Integrated Systems , Stanford University , CIS 017 MC 4070 ...
Page 132
... in Figure 5 , simulation results demonstrate the expected linearity between Ccrosstalk and ( Kpassivation ) . The ... plane After extracting ( Kpassivation ) , we utilize MEDICI TM to determine the combination of Kin - plane and Kout ...
... in Figure 5 , simulation results demonstrate the expected linearity between Ccrosstalk and ( Kpassivation ) . The ... plane After extracting ( Kpassivation ) , we utilize MEDICI TM to determine the combination of Kin - plane and Kout ...
Page 259
According to equation ( 2 ) , the thermal stress should increase monotonously with ... in the film formed from polyimide on the silicon wafers during curing and ... plane and one out - of - plane refractive indices , can be determined with ...
According to equation ( 2 ) , the thermal stress should increase monotonously with ... in the film formed from polyimide on the silicon wafers during curing and ... plane and one out - of - plane refractive indices , can be determined with ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch