Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 47
Page 145
... indicate that the molecular orientation of the rod - like polymer is altered from the blanket film orientation in submicron trenches between metal lines . In the > 10 μm wide trenches , the molecular orientation is similar to that in a ...
... indicate that the molecular orientation of the rod - like polymer is altered from the blanket film orientation in submicron trenches between metal lines . In the > 10 μm wide trenches , the molecular orientation is similar to that in a ...
Page 158
... indicate the potential to use AErms to represent material removal rate . The mean AErms signals for various material removal rates are plotted in figure 8. As expected , the figure does indicate an increasing trend in the signal ...
... indicate the potential to use AErms to represent material removal rate . The mean AErms signals for various material removal rates are plotted in figure 8. As expected , the figure does indicate an increasing trend in the signal ...
Page 280
... indicated that FSG stability depends strongly on compressive film stress , the effect of both refractive index and film stress on the wet ... indicate compressive stress . Films were etched in 100 : 1 HF . Wet Etch Rate ( Å / min . ) Wet 280.
... indicated that FSG stability depends strongly on compressive film stress , the effect of both refractive index and film stress on the wet ... indicate compressive stress . Films were etched in 100 : 1 HF . Wet Etch Rate ( Å / min . ) Wet 280.
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch