Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 49
Page 145
These observations indicate that the molecular orientation of the rod - like polymer is altered from the blanket film orientation in submicron trenches between metal lines . In the > 10 um wide trenches , the molecular orientation is ...
These observations indicate that the molecular orientation of the rod - like polymer is altered from the blanket film orientation in submicron trenches between metal lines . In the > 10 um wide trenches , the molecular orientation is ...
Page 158
The experimental data indicates the trend of increasing signal amplitude with increasing wafer motion speed . ... The experimental data in this graph also indicate a positive proportional relationship between the signal and the variable ...
The experimental data indicates the trend of increasing signal amplitude with increasing wafer motion speed . ... The experimental data in this graph also indicate a positive proportional relationship between the signal and the variable ...
Page 280
Since our previous work indicated that FSG stability depends strongly on compressive film stress , the effect of both refractive index and film stress on the wet etch rate was investigated . Films were deposited using both high and low ...
Since our previous work indicated that FSG stability depends strongly on compressive film stress , the effect of both refractive index and film stress on the wet etch rate was investigated . Films were deposited using both high and low ...
What people are saying - Write a review
We haven't found any reviews in the usual places.
Contents
Polynorbornene for Lowk Interconnection | 3 |
High Thermal Stability for ULSI Interlayer Dielectric | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
33 other sections not shown
Other editions - View all
Common terms and phrases
addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode modulus moisture observed obtained occurs oxide oxygen PA-N peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films solution spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer