Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 13
Page 33
... initial value . Some of the films have a dielectric constant around 2.4 . For the same film , the tan 8 , shown in Figure 4 , shows a marked decrease upon heating . The initial value is around 0.12 , then drops to 0.035 and remains ...
... initial value . Some of the films have a dielectric constant around 2.4 . For the same film , the tan 8 , shown in Figure 4 , shows a marked decrease upon heating . The initial value is around 0.12 , then drops to 0.035 and remains ...
Page 88
... initial copolymer morphology ( see Figure 2 ) . It is important that the initial block copolymer morphology is in the Phase separated Imide / Lablle Copolymer Above Labile Block Td. 888.
... initial copolymer morphology ( see Figure 2 ) . It is important that the initial block copolymer morphology is in the Phase separated Imide / Lablle Copolymer Above Labile Block Td. 888.
Page 151
... initial failure , is not seen for tests performed at lower pressures . Figure 2 shows the dielectric breakdown of the PP film as a function of interfacial pressure . The breakdown voltage decreased as the pressure was increased on the ...
... initial failure , is not seen for tests performed at lower pressures . Figure 2 shows the dielectric breakdown of the PP film as a function of interfacial pressure . The breakdown voltage decreased as the pressure was increased on the ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch