Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 37
... integrated circuit manufacturers . INTRODUCTION The need for low k dielectric materials to reduce capacitance in multilevel metal interconnects of integrated circuits is well known in the semiconductor industry . As transistor scaling ...
... integrated circuit manufacturers . INTRODUCTION The need for low k dielectric materials to reduce capacitance in multilevel metal interconnects of integrated circuits is well known in the semiconductor industry . As transistor scaling ...
Page 87
... integrated into integrated circuit production . The greatest limiting factor in materials qualification are the stringent IC processing conditions ( thermal stability , resistance to chemical / mechanical treatments ) . Current ...
... integrated into integrated circuit production . The greatest limiting factor in materials qualification are the stringent IC processing conditions ( thermal stability , resistance to chemical / mechanical treatments ) . Current ...
Page 197
... integrated circuit and therefore special consideration needs to be given to those materials which will successfully integrate into an integrated circuit . Parylene is just such a material and already has been incorporated into high ...
... integrated circuit and therefore special consideration needs to be given to those materials which will successfully integrate into an integrated circuit . Parylene is just such a material and already has been incorporated into high ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch