Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 37
... integrated circuit manufacturers . INTRODUCTION The need for low k dielectric materials to reduce capacitance in multilevel metal interconnects of integrated circuits is well known in the semiconductor industry . As transistor scaling ...
... integrated circuit manufacturers . INTRODUCTION The need for low k dielectric materials to reduce capacitance in multilevel metal interconnects of integrated circuits is well known in the semiconductor industry . As transistor scaling ...
Page 87
... integrated circuits ( IC ) . As microelectronic device dimensions decrease and functionality density increases , there is a great increase in complexity of chip interconnection . This on - chip device interconnection is manufactured in ...
... integrated circuits ( IC ) . As microelectronic device dimensions decrease and functionality density increases , there is a great increase in complexity of chip interconnection . This on - chip device interconnection is manufactured in ...
Page 207
... CIRCUITS R. SHARANGPANI * AND R. SINGH ** * Clemson University , Department of Electrical and Computer Engineering , Clemson , SC 29634-0915 ** Clemson University , Department of Electrical ... Integrated Circuits R Sharangpani and R Singh.
... CIRCUITS R. SHARANGPANI * AND R. SINGH ** * Clemson University , Department of Electrical and Computer Engineering , Clemson , SC 29634-0915 ** Clemson University , Department of Electrical ... Integrated Circuits R Sharangpani and R Singh.
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch