Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 83
... Interface definition The interface observed by XTEM had a smooth topography with a clear dis- continuity between CuTi and PI . We could see neither metal particles inside PI nor remarkable interface roughening , related to the fast ...
... Interface definition The interface observed by XTEM had a smooth topography with a clear dis- continuity between CuTi and PI . We could see neither metal particles inside PI nor remarkable interface roughening , related to the fast ...
Page 285
... interface can be very small ( 3-5 nm ) , the polymer / metal interface can greatly affect the deformation behavior of the entire system . INTRODUCTION In this paper we examine the adhesion and interfacial properties of Al ( Cu - Si ) on ...
... interface can be very small ( 3-5 nm ) , the polymer / metal interface can greatly affect the deformation behavior of the entire system . INTRODUCTION In this paper we examine the adhesion and interfacial properties of Al ( Cu - Si ) on ...
Page 289
... interface are greatly strengthened by the interface , and the higher strength at lower thickness might just show that a greater proportion of the metal in the thinner lines are modified by the interface . 8,9,10 As mentioned previously ...
... interface are greatly strengthened by the interface , and the higher strength at lower thickness might just show that a greater proportion of the metal in the thinner lines are modified by the interface . 8,9,10 As mentioned previously ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch