Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 21
Page 19
... interlayer dielectric ( ILD ) structure in order to enhance resistance to oxygen plasma . This study describes adhesion failure mechanisms for the sandwiched fluorinated amorphous carbon film ( a - C : F ) structure during oxygen plasma ...
... interlayer dielectric ( ILD ) structure in order to enhance resistance to oxygen plasma . This study describes adhesion failure mechanisms for the sandwiched fluorinated amorphous carbon film ( a - C : F ) structure during oxygen plasma ...
Page 31
... inter - layer dielectric films in the interconnect structure of integrated circuits . Glow discharge work has shown that organic thin films for interlayer dielectric applications made using simple fluorohydrocarbon gas mixtures can have ...
... inter - layer dielectric films in the interconnect structure of integrated circuits . Glow discharge work has shown that organic thin films for interlayer dielectric applications made using simple fluorohydrocarbon gas mixtures can have ...
Page 113
LOW DIELECTRIC CONSTANT FLUORINATED POLYIMIDES FOR INTERLAYER DIELECTRIC APPLICATIONS John Pellerin * , Robert Fox and Huei - Min Ho ** , SEMATECH , 2706 Montopolis Drive , Austin , TX 78741 * On Assignment from AMD , Inc. , Austin , TX ...
LOW DIELECTRIC CONSTANT FLUORINATED POLYIMIDES FOR INTERLAYER DIELECTRIC APPLICATIONS John Pellerin * , Robert Fox and Huei - Min Ho ** , SEMATECH , 2706 Montopolis Drive , Austin , TX 78741 * On Assignment from AMD , Inc. , Austin , TX ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch