Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 91
... labile block systems . The labile blocks must also be synthesized in such a way as to allow for their incorporation into a polyimide copolymer synthesis . The common approach has been to use aminophenyl - terminated labile blocks ...
... labile block systems . The labile blocks must also be synthesized in such a way as to allow for their incorporation into a polyimide copolymer synthesis . The common approach has been to use aminophenyl - terminated labile blocks ...
Page 93
... labile block we were able to calculate the theoretical volume fraction of the various blocks . Block copolymer containing various amounts of labile block were obtained though we concentrated our efforts on copolymers containing 15-30 % ( ...
... labile block we were able to calculate the theoretical volume fraction of the various blocks . Block copolymer containing various amounts of labile block were obtained though we concentrated our efforts on copolymers containing 15-30 % ( ...
Page 94
... labile block oligomers with amino - aryl endgroup functionality . This functionalization was achieved by two routes ; modification of existing endgroups or synthesis of the labile block oligomer with functionalized initiators . The ...
... labile block oligomers with amino - aryl endgroup functionality . This functionalization was achieved by two routes ; modification of existing endgroups or synthesis of the labile block oligomer with functionalized initiators . The ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch