Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 10
... light - tight probe stage . Samples were prepared by sputtering Ta / Cu / Ta onto oxidized Si wafers , spin - coating the polymer onto the Ta surface , and subsequently sputtering 0.25 inch diameter Al CV dots through a physical mask ...
... light - tight probe stage . Samples were prepared by sputtering Ta / Cu / Ta onto oxidized Si wafers , spin - coating the polymer onto the Ta surface , and subsequently sputtering 0.25 inch diameter Al CV dots through a physical mask ...
Page 207
... light source in a computerized rapid isothermal processing ( RIP ) sys- tem . Recently , we have extensively characterized the films and examined the suitability of our tech- nique in light of some of the requirements of the future IC ...
... light source in a computerized rapid isothermal processing ( RIP ) sys- tem . Recently , we have extensively characterized the films and examined the suitability of our tech- nique in light of some of the requirements of the future IC ...
Page 253
... light ( fig . 1a ) and the X - ray diffraction pattern exhibits separate rings ( fig . 1b ) . 10 1 Figure 1. ( a ) PMDA / TOL spherulties under polarized light ; ( b ) PMDA / TOL X - ray diffraction pattern CONCLUSION New routes to ...
... light ( fig . 1a ) and the X - ray diffraction pattern exhibits separate rings ( fig . 1b ) . 10 1 Figure 1. ( a ) PMDA / TOL spherulties under polarized light ; ( b ) PMDA / TOL X - ray diffraction pattern CONCLUSION New routes to ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch