Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 51
... low dielectric constant materials , including fluorination of SiO2 , low - k organic polymers , and porous materials . No one material satisfies all the requirements for multilevel interconnections , which include low dielectric ...
... low dielectric constant materials , including fluorination of SiO2 , low - k organic polymers , and porous materials . No one material satisfies all the requirements for multilevel interconnections , which include low dielectric ...
Page 87
... low dielectric constant materials that can be integrated into integrated circuit production . The greatest limiting factor in materials qualification are the stringent IC processing conditions ( thermal stability , resistance to ...
... low dielectric constant materials that can be integrated into integrated circuit production . The greatest limiting factor in materials qualification are the stringent IC processing conditions ( thermal stability , resistance to ...
Page 99
... low thermal expansion and are thermally stable to temperatures exceeding 500 ° C . However , due to the open porosity and large surface areas for aerogels , their dielectric ... Dielectric Constant for Bulk Silica Aerogels W Hrubesh and S R ...
... low thermal expansion and are thermally stable to temperatures exceeding 500 ° C . However , due to the open porosity and large surface areas for aerogels , their dielectric ... Dielectric Constant for Bulk Silica Aerogels W Hrubesh and S R ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch