Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 51
DIRECT PATTERNING OF LOW - K MATERIAL FOR DAMASCENE PROCESS Cheng - Jye Chu , C.-T. Chu , and Q. Wei , CHEMAT ... materials , including fluorination of SiO2 , low - k organic polymers , and porous materials . No one material satisfies ...
DIRECT PATTERNING OF LOW - K MATERIAL FOR DAMASCENE PROCESS Cheng - Jye Chu , C.-T. Chu , and Q. Wei , CHEMAT ... materials , including fluorination of SiO2 , low - k organic polymers , and porous materials . No one material satisfies ...
Page 75
... Materials , Santa Clara , CA 95054 *** SEMATECH , 2706 Montopolis Drive , Austin , TX 78741 ABSTRACT Interactions between ... low dielectric constant ( low - k ) materials that can replace the commonly used SiO2 insulators as interlevel ...
... Materials , Santa Clara , CA 95054 *** SEMATECH , 2706 Montopolis Drive , Austin , TX 78741 ABSTRACT Interactions between ... low dielectric constant ( low - k ) materials that can replace the commonly used SiO2 insulators as interlevel ...
Page 155
LOW - K DIELECTRIC MATERIAL CHEMICAL MECHANICAL POLISHING PROCESS MONITORING USING ACOUSTIC EMISSION JIANSHE TANG , CARSTEN UNGER , YONGSIK MOON , DAVID DORNFELD Department of Mechanical Engineering University of California at Berkeley ...
LOW - K DIELECTRIC MATERIAL CHEMICAL MECHANICAL POLISHING PROCESS MONITORING USING ACOUSTIC EMISSION JIANSHE TANG , CARSTEN UNGER , YONGSIK MOON , DAVID DORNFELD Department of Mechanical Engineering University of California at Berkeley ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch