Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 25
... Materials , 3500 Garrett Drive , Santa Clara , CA 95054-2827 Introduction . Low dielectric constant materials ( k < 3.0 ) have the advantage that higher performance IC devices may be manufactured with minimal increases in chip size ...
... Materials , 3500 Garrett Drive , Santa Clara , CA 95054-2827 Introduction . Low dielectric constant materials ( k < 3.0 ) have the advantage that higher performance IC devices may be manufactured with minimal increases in chip size ...
Page 53
... materials after heat treatment at different temperatures and different atmospheres was measured by BET . However , the data showed a very small surface area for all these materials . This means the organic burn - off process creates ...
... materials after heat treatment at different temperatures and different atmospheres was measured by BET . However , the data showed a very small surface area for all these materials . This means the organic burn - off process creates ...
Page 87
... materials , both conductors and insulators must change from currently used materials . To this end , we are actively in search of low dielectric constant materials that can be integrated into integrated circuit production . The greatest ...
... materials , both conductors and insulators must change from currently used materials . To this end , we are actively in search of low dielectric constant materials that can be integrated into integrated circuit production . The greatest ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch