Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 90
... Matrices was of interest because of its prior use in microelectronics . The highly fluorinated 6FXDA / 6FDAM polyimide was chosen because of its low dielectric constant and low ... matrix , be thermally stable during the processing of 90 90.
... Matrices was of interest because of its prior use in microelectronics . The highly fluorinated 6FXDA / 6FDAM polyimide was chosen because of its low dielectric constant and low ... matrix , be thermally stable during the processing of 90 90.
Page 91
polyimide matrix , be thermally stable during the processing of the copolymer film and must degrade quantitatively during the thermolysis step . The difference between the highest temperature the labile block must withstand during ...
polyimide matrix , be thermally stable during the processing of the copolymer film and must degrade quantitatively during the thermolysis step . The difference between the highest temperature the labile block must withstand during ...
Page 95
... matrix , represent one of the best candidates to date to generate low dielectric foams . Another advantage of the foamed polymers is the lowering of residual thin film stress . In the case of PMDA / 3FDA the residual stress of the ...
... matrix , represent one of the best candidates to date to generate low dielectric foams . Another advantage of the foamed polymers is the lowering of residual thin film stress . In the case of PMDA / 3FDA the residual stress of the ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch