Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 79
Page 100
... measured by two methods , micrometry and microscopy ; the two measurement quantities were averaged to obtain a final value used for calaculations . The densities of the spheres were determined gravimetrically , using the pre - measured ...
... measured by two methods , micrometry and microscopy ; the two measurement quantities were averaged to obtain a final value used for calaculations . The densities of the spheres were determined gravimetrically , using the pre - measured ...
Page 201
... measurement of dielectric permittivity . The area of each dot was measured with a microscope at a resolution of 0.1 mm with a dot size of about 8.5 mm . Copolymer thickness was measured prior to dot formation across each wafer with ...
... measurement of dielectric permittivity . The area of each dot was measured with a microscope at a resolution of 0.1 mm with a dot size of about 8.5 mm . Copolymer thickness was measured prior to dot formation across each wafer with ...
Page 233
... measured using bare silicon wafers and a Nanospec 200 spectroscopic interferometer . Nanospec provided an updated algorithm for measuring the PTFE . The breakdown field strength and current leakage measurements were made using a dual ...
... measured using bare silicon wafers and a Nanospec 200 spectroscopic interferometer . Nanospec provided an updated algorithm for measuring the PTFE . The breakdown field strength and current leakage measurements were made using a dual ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch