Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 32
... measurements is a parallel plate capacitor consisting of two conductive plates and the material of interest as the dielectric . To make the capacitor structure , a 500Å TIN / 7500Å W / 500Å TIN stack was grown on p- type Si as the ...
... measurements is a parallel plate capacitor consisting of two conductive plates and the material of interest as the dielectric . To make the capacitor structure , a 500Å TIN / 7500Å W / 500Å TIN stack was grown on p- type Si as the ...
Page 96
... measurements on samples especially when making comparative measurements on samples of similar chemical composition . Measurements of the dielectric constants of several thin films nanofoams have been made and the results are encouraging ...
... measurements on samples especially when making comparative measurements on samples of similar chemical composition . Measurements of the dielectric constants of several thin films nanofoams have been made and the results are encouraging ...
Page 100
... measurement quantities were averaged to obtain a final value used for calaculations . The densities of the spheres were determined gravimetrically , using the pre - measured diameters . The spheres selected for the final measurements ...
... measurement quantities were averaged to obtain a final value used for calaculations . The densities of the spheres were determined gravimetrically , using the pre - measured diameters . The spheres selected for the final measurements ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch