Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 53
Page 19
... mechanical strength requires low - pressure Chemical Mechanical Polishing ( CMP ) , This process has the disadvantages of a low polishing rate and a susceptibility to scratches on the polished surface . To overcome the weak strength and ...
... mechanical strength requires low - pressure Chemical Mechanical Polishing ( CMP ) , This process has the disadvantages of a low polishing rate and a susceptibility to scratches on the polished surface . To overcome the weak strength and ...
Page 51
... mechanical strength , good dimensional stability , good high temperature stability , easy processing , and low H2O absorption and outgassing . In this research , a new material system has been studied . This process - controlled low - k ...
... mechanical strength , good dimensional stability , good high temperature stability , easy processing , and low H2O absorption and outgassing . In this research , a new material system has been studied . This process - controlled low - k ...
Page 161
... mechanical polishing ( CMP ) is influenced by 3 factors : slurry composition , quality of the as - deposited film or post - deposition treated film , and polishing time . The quality of the films has been investigated by using X - ray ...
... mechanical polishing ( CMP ) is influenced by 3 factors : slurry composition , quality of the as - deposited film or post - deposition treated film , and polishing time . The quality of the films has been investigated by using X - ray ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch