Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 4
... properties . The dielectric constants are higher than desired and generally fall between 3.0 and 3.5 . The moisture ... mechanical properties . CYCLIC OLEFIN DIELECTRICS A family of polymers based principally on polynorbornene is being ...
... properties . The dielectric constants are higher than desired and generally fall between 3.0 and 3.5 . The moisture ... mechanical properties . CYCLIC OLEFIN DIELECTRICS A family of polymers based principally on polynorbornene is being ...
Page 51
... mechanical strength , good dimensional stability , good high temperature ... properties . However , this Chemat - B polymer can be converted to an ... properties that fit the requirements for multilevel interconnections . The curing ...
... mechanical strength , good dimensional stability , good high temperature ... properties . However , this Chemat - B polymer can be converted to an ... properties that fit the requirements for multilevel interconnections . The curing ...
Page 135
... properties to integration problems . Finite Element modeling is a powerful tool to address such issues , but the thermal and mechanical properties of the materials modeled must be known . The measurement of thermal and mechanical properties ...
... properties to integration problems . Finite Element modeling is a powerful tool to address such issues , but the thermal and mechanical properties of the materials modeled must be known . The measurement of thermal and mechanical properties ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch