Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 77
... metal layer ( Al ) shows no difference under this magnification . Note that above the threshold temperature the interface between Al and Ti is not well defined and appears relatively rough , showing a block grain structure . A bright ...
... metal layer ( Al ) shows no difference under this magnification . Note that above the threshold temperature the interface between Al and Ti is not well defined and appears relatively rough , showing a block grain structure . A bright ...
Page 265
... metal blistering from the oxide film . Figure 7 is an optical microscope top view of the poly - silicon / TiSi2 pads in one of the wafers in Experiment 1. As discussed previously , F atoms may diffuse through the inter - layer ...
... metal blistering from the oxide film . Figure 7 is an optical microscope top view of the poly - silicon / TiSi2 pads in one of the wafers in Experiment 1. As discussed previously , F atoms may diffuse through the inter - layer ...
Page 289
... metal and polymer are not correct . There is reason to believe that the properties of the metal and polymer next to the interface are greatly strengthened by the interface , and the higher strength at lower thickness might just show ...
... metal and polymer are not correct . There is reason to believe that the properties of the metal and polymer next to the interface are greatly strengthened by the interface , and the higher strength at lower thickness might just show ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch