Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 100
... method described earlier [ 6 ] using tetramethoxysilane precursor injected into mineral oil . This method generally produces gels having very uniform spherical shapes . The aerogels were dried by direct supercritical extraction of the ...
... method described earlier [ 6 ] using tetramethoxysilane precursor injected into mineral oil . This method generally produces gels having very uniform spherical shapes . The aerogels were dried by direct supercritical extraction of the ...
Page 101
... method . Resonance perturbation is a common method for measuring dielectric constants of materials , particularly at microwave frequencies [ 7,8 ] . The specific case for a small dielectric sphere in a TE10 mode waveguide cavity has ...
... method . Resonance perturbation is a common method for measuring dielectric constants of materials , particularly at microwave frequencies [ 7,8 ] . The specific case for a small dielectric sphere in a TE10 mode waveguide cavity has ...
Page 233
... methods and the breakdown voltage and the leakage current were measured . The first method was a 390 ° C contact sinter for 5 minutes followed by a quench on a chill plate at a temperature of 13 ° C . The second method allowed the wafer ...
... methods and the breakdown voltage and the leakage current were measured . The first method was a 390 ° C contact sinter for 5 minutes followed by a quench on a chill plate at a temperature of 13 ° C . The second method allowed the wafer ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch