Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 99
... microwave frequency , using a cavity perturbation method . The results of the dependence found here for bulk materials can be inferred to apply also to thin films of silica aerogels having similar nano - structures and densities ...
... microwave frequency , using a cavity perturbation method . The results of the dependence found here for bulk materials can be inferred to apply also to thin films of silica aerogels having similar nano - structures and densities ...
Page 101
... microwave spectrum analyzer K thru holes in waveguide diode detector Fig . 1. Apparatus for measuring the temperature dependence of dielectric constant for spherical samples by microwave cavity resonance perturbation method . Resonance ...
... microwave spectrum analyzer K thru holes in waveguide diode detector Fig . 1. Apparatus for measuring the temperature dependence of dielectric constant for spherical samples by microwave cavity resonance perturbation method . Resonance ...
Page 102
microwave cavity . As the sphere traverses the cavity , it causes a momentary shift of the cavity resonance frequency . The resonant frequency shift is recorded and stored in less than 20msec , using a Hewlett - Packard Model 8565A ...
microwave cavity . As the sphere traverses the cavity , it causes a momentary shift of the cavity resonance frequency . The resonant frequency shift is recorded and stored in less than 20msec , using a Hewlett - Packard Model 8565A ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch