Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 273
... mode where the O atom motion is normal to the Si - O - Si bonding plane . The bond - stretching and bond - bending modes both involve stretching and bending forces , and have also been characterized , respectively , as symmetric and ...
... mode where the O atom motion is normal to the Si - O - Si bonding plane . The bond - stretching and bond - bending modes both involve stretching and bending forces , and have also been characterized , respectively , as symmetric and ...
Page 277
... mode , the force constant is increased . The rocking mode in Fig . 3 ( c ) displays a markedly different dependence than either of the other two modes , with F atom substitution leading to a decreased force constant at all angles . In ...
... mode , the force constant is increased . The rocking mode in Fig . 3 ( c ) displays a markedly different dependence than either of the other two modes , with F atom substitution leading to a decreased force constant at all angles . In ...
Page 278
... modes , where the modes most effected are those with the smallest bond angles and the smallest IR moments . The reverse is true for the bond - bending modes , and the anticipated fractional decrease in this mode at ~ 800 cm - 1 is ...
... modes , where the modes most effected are those with the smallest bond angles and the smallest IR moments . The reverse is true for the bond - bending modes , and the anticipated fractional decrease in this mode at ~ 800 cm - 1 is ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch