Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 27
Page 14
... modulus of polymers to be two orders of magnitude less than that of mineral dielectrics . On the other hand , the coefficient of thermal expansion of polymers can be as much as two orders of magnitude greater than for inorganic minerals ...
... modulus of polymers to be two orders of magnitude less than that of mineral dielectrics . On the other hand , the coefficient of thermal expansion of polymers can be as much as two orders of magnitude greater than for inorganic minerals ...
Page 15
... modulus , loss modulus , and loss tangent up to 490 ° C . There is no appreciable transition for any of these properties over the range of measurement . Therefore , the Tg of SILK is in excess of 490 ° C . Figure 5 shows the dimensional ...
... modulus , loss modulus , and loss tangent up to 490 ° C . There is no appreciable transition for any of these properties over the range of measurement . Therefore , the Tg of SILK is in excess of 490 ° C . Figure 5 shows the dimensional ...
Page 139
... modulus and TEC of a TEOS film were measured using the bending beam system in order to test the sensitivity of the system for porous and brittle film applications . Equation 2 relates the slope of the stress - temperature curve to E ...
... modulus and TEC of a TEOS film were measured using the bending beam system in order to test the sensitivity of the system for porous and brittle film applications . Equation 2 relates the slope of the stress - temperature curve to E ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch