Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 16
... Moisture Uptake Figure 7 shows the mass uptake of 12 μm thick films of SILK during relative humidity swings from dry to the indicated humidity levels . The maximum moisture uptake at 80 % RH is 0.24 wt . % . This low level of moisture ...
... Moisture Uptake Figure 7 shows the mass uptake of 12 μm thick films of SILK during relative humidity swings from dry to the indicated humidity levels . The maximum moisture uptake at 80 % RH is 0.24 wt . % . This low level of moisture ...
Page 99
... moisture and temperature . This paper presents data for the dielectric constants of silica aerogels as a function of moisture content at 25 ° C , and as a function of temperature , for temperatures in the range from 25 ° C to 450 ° C ...
... moisture and temperature . This paper presents data for the dielectric constants of silica aerogels as a function of moisture content at 25 ° C , and as a function of temperature , for temperatures in the range from 25 ° C to 450 ° C ...
Page 108
... moisture is desorbed from the film . Moisture would also explain the subsequent increase in the dielectric constant , as water is adsorbed onto the film with time . Before bake Immediately after bake Recipe A 6.49 Recipe 6.95 B 4.29 ...
... moisture is desorbed from the film . Moisture would also explain the subsequent increase in the dielectric constant , as water is adsorbed onto the film with time . Before bake Immediately after bake Recipe A 6.49 Recipe 6.95 B 4.29 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch