Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 4
... molecular weight . The final molecular weight of the polymer can be tailored to meet specific application requirements by controlling the amount of chain transfer agent that is used . In addition to controlling molecular weight ...
... molecular weight . The final molecular weight of the polymer can be tailored to meet specific application requirements by controlling the amount of chain transfer agent that is used . In addition to controlling molecular weight ...
Page 35
... molecular weight com- pounds that evaporate upon heating . Finally , its presence as a network end - group can alter the decomposition kinetics of the film . Κ Thermal stability data supports the idea that the presence of fluorine ...
... molecular weight com- pounds that evaporate upon heating . Finally , its presence as a network end - group can alter the decomposition kinetics of the film . Κ Thermal stability data supports the idea that the presence of fluorine ...
Page 145
... molecular alignment than flexible chain polymers resulting in relatively more anisotropic electrical , thermal , and ... molecular orientation of the rod - like polymer is altered from the blanket film orientation in submicron trenches ...
... molecular alignment than flexible chain polymers resulting in relatively more anisotropic electrical , thermal , and ... molecular orientation of the rod - like polymer is altered from the blanket film orientation in submicron trenches ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch