Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 4
... monomers to form saturated olefinic polymers with high Tg's . The polymerization mechanism enables a high degree of control over stereoselectivity ( i.e. how the monomers are linked together ) and molecular weight . The final molecular ...
... monomers to form saturated olefinic polymers with high Tg's . The polymerization mechanism enables a high degree of control over stereoselectivity ( i.e. how the monomers are linked together ) and molecular weight . The final molecular ...
Page 198
... monomers with gas phase molecules containing polymerizable bonds . The Gaynor / Desu method ( see reference 4 ) of ... monomer p - xylylene and mixing it in the gas phase with a polymerizable comonomer . A thin film of a random copolymer ...
... monomers with gas phase molecules containing polymerizable bonds . The Gaynor / Desu method ( see reference 4 ) of ... monomer p - xylylene and mixing it in the gas phase with a polymerizable comonomer . A thin film of a random copolymer ...
Page 219
... monomer . The monomer was then delivered to the process chamber through a high conductance vacuum line . The process chamber and delivery lines were heated to reduce polymer deposition on their inner surfaces . The monomer vapor can be ...
... monomer . The monomer was then delivered to the process chamber through a high conductance vacuum line . The process chamber and delivery lines were heated to reduce polymer deposition on their inner surfaces . The monomer vapor can be ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch