Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 41
Page 40
... observed at normalized SiH bond density less than 50 % as shown in figure 5. Best performance in terms of low dielectric constant , low stress , and stability to moisture adsorption is observed at high normalized SiH bond density . Cure ...
... observed at normalized SiH bond density less than 50 % as shown in figure 5. Best performance in terms of low dielectric constant , low stress , and stability to moisture adsorption is observed at high normalized SiH bond density . Cure ...
Page 65
... observed ( Fig . 3 ) . The lack of satellite features indicates the absence of Cu ( II ) . The Cu ( L3VV ) spectrum also shows a broad peak with a lineshape indicative of Cu ( I ) , similar to that observed upon reaction with a clean ...
... observed ( Fig . 3 ) . The lack of satellite features indicates the absence of Cu ( II ) . The Cu ( L3VV ) spectrum also shows a broad peak with a lineshape indicative of Cu ( I ) , similar to that observed upon reaction with a clean ...
Page 71
... observed . On the other hand , F was desorbed at 210 ° C from the SiOF film deposited under condition B. Gas evolution peak was at 730 ° C . From the TDS analysis , it was found that two peaks of the gas evolution was observed for the ...
... observed . On the other hand , F was desorbed at 210 ° C from the SiOF film deposited under condition B. Gas evolution peak was at 730 ° C . From the TDS analysis , it was found that two peaks of the gas evolution was observed for the ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch