Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 45
Page 93
... obtain the desired copolymers . The block copolymers were characterized by a variety of techniques . Some ... obtained though we concentrated our efforts on copolymers containing 15-30 % ( vol ) labile block with the hope that these ...
... obtain the desired copolymers . The block copolymers were characterized by a variety of techniques . Some ... obtained though we concentrated our efforts on copolymers containing 15-30 % ( vol ) labile block with the hope that these ...
Page 96
To obtain a measure of the optical anisotropy of the thin films , their in - plane and out - of- plane refractive indices were measured using a commercially available Metricon Prism Coupler . In addition to obtaining an accurate ...
To obtain a measure of the optical anisotropy of the thin films , their in - plane and out - of- plane refractive indices were measured using a commercially available Metricon Prism Coupler . In addition to obtaining an accurate ...
Page 188
... obtained from C2F6-20 % H2 . is coincident with Teflon ( 18 dynes / cm ) , while for other mixtures quite different values are obtained . Figure 4 shows that the adhesion of these films on aluminium substrates is fairly good . MPa 3 2 1 ...
... obtained from C2F6-20 % H2 . is coincident with Teflon ( 18 dynes / cm ) , while for other mixtures quite different values are obtained . Figure 4 shows that the adhesion of these films on aluminium substrates is fairly good . MPa 3 2 1 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch