Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 63
... occurring at the sample surface . XPS spectra were acquired in the fixed pass energy mode at 50 eV pass energy , using ... occurs within the dosing tube . " The organic decomposition species from the precursor completely attenuated the ...
... occurring at the sample surface . XPS spectra were acquired in the fixed pass energy mode at 50 eV pass energy , using ... occurs within the dosing tube . " The organic decomposition species from the precursor completely attenuated the ...
Page 227
... occurs after the 60 min . anneal . These trends in the X - ray data also correlate with trends observed in the FTIR spectra during annealing . The ring C - C [ 8,9 ] and C - H out - of - plane deformations at 543 and 823 cm1 ...
... occurs after the 60 min . anneal . These trends in the X - ray data also correlate with trends observed in the FTIR spectra during annealing . The ring C - C [ 8,9 ] and C - H out - of - plane deformations at 543 and 823 cm1 ...
Page 230
... occurs near the ẞ1 - ß2 crystalline phase transition and occurs in all thermal cycles after the first . ACKNOWLEDGEMENTS The authors gratefully acknowledge valuable discussions of the data with Dr. Chung Lee . REFERENCES 1 . 2 . 335 P ...
... occurs near the ẞ1 - ß2 crystalline phase transition and occurs in all thermal cycles after the first . ACKNOWLEDGEMENTS The authors gratefully acknowledge valuable discussions of the data with Dr. Chung Lee . REFERENCES 1 . 2 . 335 P ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch