Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 22
... optical view after annealing at 350 ° C without oxygen plasma , The reduction of a - C : F film thickness leads to the partial peeling failure between silicon oxide and a - C : F . Optical views of the sample of annealed wafer ( figure ...
... optical view after annealing at 350 ° C without oxygen plasma , The reduction of a - C : F film thickness leads to the partial peeling failure between silicon oxide and a - C : F . Optical views of the sample of annealed wafer ( figure ...
Page 263
... optical microscope , and electrically tested again . 3. Results and Discussion 3.1 Chemical Reactions : After the first 30 F Concentration ( 1 / cc ) 7.0x1020 Ti Oxide 6.0x1020 5.0x1020 4.0x1020 3.0x1020 2.0x1020 1 : 1.0x1020 0.0 0.04 ...
... optical microscope , and electrically tested again . 3. Results and Discussion 3.1 Chemical Reactions : After the first 30 F Concentration ( 1 / cc ) 7.0x1020 Ti Oxide 6.0x1020 5.0x1020 4.0x1020 3.0x1020 2.0x1020 1 : 1.0x1020 0.0 0.04 ...
Page 265
... optical microscope top view of the poly - silicon / TiSi2 pads in one of the wafers in Experiment 1. As discussed ... Optical microscope top view picture shows discoloration on the top of poly - Si / TiSi2 pads , indicating a reaction of ...
... optical microscope top view of the poly - silicon / TiSi2 pads in one of the wafers in Experiment 1. As discussed ... Optical microscope top view picture shows discoloration on the top of poly - Si / TiSi2 pads , indicating a reaction of ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch