Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 19
... organic films sandwiched between layers of SiO2 may be a suitable interlayer dielectric ( ILD ) structure . However , another problem remains : adhesion of the organic films to the SiO2 [ 1 ] . Thus , the interface controlling ...
... organic films sandwiched between layers of SiO2 may be a suitable interlayer dielectric ( ILD ) structure . However , another problem remains : adhesion of the organic films to the SiO2 [ 1 ] . Thus , the interface controlling ...
Page 51
... organic polymers , and porous materials . No one material satisfies all the requirements for multilevel ... organic polymers which will have a dielectric constant of 2-3 , while the third direction is to use porous materials with ...
... organic polymers , and porous materials . No one material satisfies all the requirements for multilevel ... organic polymers which will have a dielectric constant of 2-3 , while the third direction is to use porous materials with ...
Page 105
... organic - inorganic xerogel films were deposited as porous thin films by spinning the precursor sol on silicon substrates . Films of various compositions were prepared using combinations of the following precursors ...
... organic - inorganic xerogel films were deposited as porous thin films by spinning the precursor sol on silicon substrates . Films of various compositions were prepared using combinations of the following precursors ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch