Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 45
... oxide and oxynitride for IMD ( inter - metal dielectric ) planarization . Excellent chamber performance and wide process window were demonstrated . Etch selectivities between various SOG and liner films are tunable in a wide range ...
... oxide and oxynitride for IMD ( inter - metal dielectric ) planarization . Excellent chamber performance and wide process window were demonstrated . Etch selectivities between various SOG and liner films are tunable in a wide range ...
Page 61
... oxide phase enhances the F - Al bond strength compared to an F - Al bond in a metal phase by 97 kJ / mole . F - AlOx formation similarly strengthens the Al - O bond by 70 kJ / mole relative to aluminum oxide . For these reasons , aluminum ...
... oxide phase enhances the F - Al bond strength compared to an F - Al bond in a metal phase by 97 kJ / mole . F - AlOx formation similarly strengthens the Al - O bond by 70 kJ / mole relative to aluminum oxide . For these reasons , aluminum ...
Page 92
... oxide ) F3C CF3 Olofrot Scheme 2. Synthesis of Imide / Labile Triblock Copolymers : Pol ( amic alkyl ester ) Route ... oxide ) 15 9.9 9 11 3 PMDA / 3FDA ( imide ) Poly ( propylene oxide ) 25 23 4 PMDA / 3FDA ( imide ) Poly ( a ...
... oxide ) F3C CF3 Olofrot Scheme 2. Synthesis of Imide / Labile Triblock Copolymers : Pol ( amic alkyl ester ) Route ... oxide ) 15 9.9 9 11 3 PMDA / 3FDA ( imide ) Poly ( propylene oxide ) 25 23 4 PMDA / 3FDA ( imide ) Poly ( a ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch