Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 3
Page vii
... Parylene - N Films by XPS and AFM .... G - R . Yang , Y - P . Zhao , Jan M. Neirynck , Shyam P. Murarka , and Ronald ... AF - 4 Films M.A. Plano , D. Kumar , and T.J. Cleary Characterization of Parylene - N Thin Films for Low - k VLSI ...
... Parylene - N Films by XPS and AFM .... G - R . Yang , Y - P . Zhao , Jan M. Neirynck , Shyam P. Murarka , and Ronald ... AF - 4 Films M.A. Plano , D. Kumar , and T.J. Cleary Characterization of Parylene - N Thin Films for Low - k VLSI ...
Page 213
... parylene AF - 4 , an organic polymer more formally known as Poly ( α , a , a ' , a ' - tetrafluoro - p- xylylene ) . In this study parylene AF - 4 films were vapor - deposited on silicon wafers by pyrolytic decomposition of the cyclic ...
... parylene AF - 4 , an organic polymer more formally known as Poly ( α , a , a ' , a ' - tetrafluoro - p- xylylene ) . In this study parylene AF - 4 films were vapor - deposited on silicon wafers by pyrolytic decomposition of the cyclic ...
Page 299
... polymer , 3 , 9 , 75 , 81 oxidation , 75 oxide cap , 45 oxydiphthalic anhydride , 255 para catenation , 249 parylene ( - ) , 197 , 225 AF - 4 , 213 copolymer , 197 N , 161 , 219 PECVD , 261 peeling , 69 photosensitive , 51 polyimide ...
... polymer , 3 , 9 , 75 , 81 oxidation , 75 oxide cap , 45 oxydiphthalic anhydride , 255 para catenation , 249 parylene ( - ) , 197 , 225 AF - 4 , 213 copolymer , 197 N , 161 , 219 PECVD , 261 peeling , 69 photosensitive , 51 polyimide ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch