Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 130
... passivation dielectric . For identical structures passivated by other dielectrics , ( Cbottom + Cside ) remains invariant . Hence , Ccrosstalk is a linear function of ( Kpassivation ) defined by measuring Ccrosstalk of structures passivated ...
... passivation dielectric . For identical structures passivated by other dielectrics , ( Cbottom + Cside ) remains invariant . Hence , Ccrosstalk is a linear function of ( Kpassivation ) defined by measuring Ccrosstalk of structures passivated ...
Page 132
... passivation dielectrics thinner than 1.0 μm , Ccrosstalk no longer remains constant since fringing fields now spread beyond the passivation layer into the dielectric above— air for TEOS passivation and 0.18 μm nitride ( K = 7.4 ) for ...
... passivation dielectrics thinner than 1.0 μm , Ccrosstalk no longer remains constant since fringing fields now spread beyond the passivation layer into the dielectric above— air for TEOS passivation and 0.18 μm nitride ( K = 7.4 ) for ...
Page 133
... passivation 。 TEOS passivation 0.16 Polyimide passivation 1.5 0.15 TEOS y ( um ) 1.2 0.9 0.6 0.3 0 Go оо Ccrosstalk ( fF / μm ) 0.14 polyimide + 0.18μm nitride 0.13 polyimide 0.12 unpassivated n - Si comb & n - Si grounded ( a ) 0.0 ...
... passivation 。 TEOS passivation 0.16 Polyimide passivation 1.5 0.15 TEOS y ( um ) 1.2 0.9 0.6 0.3 0 Go оо Ccrosstalk ( fF / μm ) 0.14 polyimide + 0.18μm nitride 0.13 polyimide 0.12 unpassivated n - Si comb & n - Si grounded ( a ) 0.0 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch