Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 57
... Patterns to Cure Chemat - B Film Spin - on and Reflow for Second Layers Expose Patterns to Cure Second Layer Recycle Chemat- B Solution Washout Uncured Regions by Solvents Heat - Treat to Adjust Properties Metallization ( CVD + CMP ...
... Patterns to Cure Chemat - B Film Spin - on and Reflow for Second Layers Expose Patterns to Cure Second Layer Recycle Chemat- B Solution Washout Uncured Regions by Solvents Heat - Treat to Adjust Properties Metallization ( CVD + CMP ...
Page 77
... patterns ( a and b ) are obtained from the area of the ILD / Al interface and the center of the metal layer as ... pattern can be observed corresponding to the ILD / Al interface region . This indicates that there is an amorphous ...
... patterns ( a and b ) are obtained from the area of the ILD / Al interface and the center of the metal layer as ... pattern can be observed corresponding to the ILD / Al interface region . This indicates that there is an amorphous ...
Page 253
... pattern exhibits separate rings ( fig . 1b ) . 10 1 Figure 1. ( a ) PMDA / TOL spherulties under polarized light ; ( b ) PMDA / TOL X - ray diffraction pattern CONCLUSION New routes to polymide precursors have been developed to. 253.
... pattern exhibits separate rings ( fig . 1b ) . 10 1 Figure 1. ( a ) PMDA / TOL spherulties under polarized light ; ( b ) PMDA / TOL X - ray diffraction pattern CONCLUSION New routes to polymide precursors have been developed to. 253.
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch