Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 3
... performance . The scaling of transitors toward smaller dimensions , higher speeds , and lower power has resulted in an urgent need for low dielectric constant interlevel insulators . Low dielectric constant interlevel dielectrics have ...
... performance . The scaling of transitors toward smaller dimensions , higher speeds , and lower power has resulted in an urgent need for low dielectric constant interlevel insulators . Low dielectric constant interlevel dielectrics have ...
Page 45
... performance and wide process window were demonstrated . Etch selectivities between various SOG and liner films are tunable in a wide range allowing optimization of IMD planarization . INTRODUCTION In semiconductor fabrication , spin ...
... performance and wide process window were demonstrated . Etch selectivities between various SOG and liner films are tunable in a wide range allowing optimization of IMD planarization . INTRODUCTION In semiconductor fabrication , spin ...
Page 197
... performance integrated circuits . Parylenes are a class of polymers formed by chemical vapor deposition which nearly meet the high standards of the low - k triumvirate , namely , 1 ) adhesion , particularly to SiO2 , 2 ) thermal ...
... performance integrated circuits . Parylenes are a class of polymers formed by chemical vapor deposition which nearly meet the high standards of the low - k triumvirate , namely , 1 ) adhesion , particularly to SiO2 , 2 ) thermal ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch