Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 197
... permittivity would be beneficial from both device performance and extendibility points - of - view . We have synthesized various Parylene - N - based copolymers with improved adhesion , thermal stability , and permittivity . We ...
... permittivity would be beneficial from both device performance and extendibility points - of - view . We have synthesized various Parylene - N - based copolymers with improved adhesion , thermal stability , and permittivity . We ...
Page 200
... Permittivity Figure 5 displays the measured permittivity at 100 kHz of metal - insulator - metal capacitors formed by shadow mask of aluminum dots on annealed copolymer films deposited on conducting , antimony - doped wafers of ...
... Permittivity Figure 5 displays the measured permittivity at 100 kHz of metal - insulator - metal capacitors formed by shadow mask of aluminum dots on annealed copolymer films deposited on conducting , antimony - doped wafers of ...
Page 201
... Permittivity 4.2 4.03 3.9 3.6 3.3 3.0 2.72 2.7 2.51 2.36 2.34 2.4 2.38 2.29 2.1 2.18 2.04 2.12 2.13 1.8 1.5 SiO2 Pa - N CP Th CP P CP FF CP TV Figure 5 Measured permittivity of Parylene - based copolymers ( 100 kHz ) . Statistical error ...
... Permittivity 4.2 4.03 3.9 3.6 3.3 3.0 2.72 2.7 2.51 2.36 2.34 2.4 2.38 2.29 2.1 2.18 2.04 2.12 2.13 1.8 1.5 SiO2 Pa - N CP Th CP P CP FF CP TV Figure 5 Measured permittivity of Parylene - based copolymers ( 100 kHz ) . Statistical error ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch