Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 21
Page 45
... planarization . Excellent chamber performance and wide process window were demonstrated . Etch selectivities between various SOG and liner films are tunable in a wide range allowing optimization of IMD planarization . INTRODUCTION In ...
... planarization . Excellent chamber performance and wide process window were demonstrated . Etch selectivities between various SOG and liner films are tunable in a wide range allowing optimization of IMD planarization . INTRODUCTION In ...
Page 50
... planarization with low K SOP 418 , TEOS and SiON . Low SOG etch non - uniformity and tunable etch selectivity to the liner films using MXP + chamber allow optimization of IMD planarization after etchback . ACKNOWLEDGMENTS K.G. Huang ...
... planarization with low K SOP 418 , TEOS and SiON . Low SOG etch non - uniformity and tunable etch selectivity to the liner films using MXP + chamber allow optimization of IMD planarization after etchback . ACKNOWLEDGMENTS K.G. Huang ...
Page 155
... planarization due to the lower hardness relative to silicon dioxide . This research relates to a methodology for in - situ monitoring of the low - k dielectric material CMP planarization process , specifically for monitoring material ...
... planarization due to the lower hardness relative to silicon dioxide . This research relates to a methodology for in - situ monitoring of the low - k dielectric material CMP planarization process , specifically for monitoring material ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch