Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 161
... polished BCB film is 5Å , and 20Å , respectively . The morphology of the PA - N film , either as - deposited or polished , is not as good as the BCB film . A slurry which is good for BCB polishing is not good for PA - N polishing , and ...
... polished BCB film is 5Å , and 20Å , respectively . The morphology of the PA - N film , either as - deposited or polished , is not as good as the BCB film . A slurry which is good for BCB polishing is not good for PA - N polishing , and ...
Page 163
... Polishing in different slurries causes changes in surface structure as well as morphology . XPS results show that the film polished in slurry - 1 does not change the ratio of C - O to C - C Dielectric Constant 3.6 34 3.2 I 3.0 2.8 2.6 ...
... Polishing in different slurries causes changes in surface structure as well as morphology . XPS results show that the film polished in slurry - 1 does not change the ratio of C - O to C - C Dielectric Constant 3.6 34 3.2 I 3.0 2.8 2.6 ...
Page 165
... polished in different slurries . XPS results show that the films polished in slurry - 1 or slurry - 2 do not change total oxygen content ; however , the ratios of C - O to C - C bond are much different . Film polished in slurry - 1 has ...
... polished in different slurries . XPS results show that the films polished in slurry - 1 or slurry - 2 do not change total oxygen content ; however , the ratios of C - O to C - C bond are much different . Film polished in slurry - 1 has ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch